Get a Quote for Cut to Size Panels

Upload your cut list and we’ll quote cutting, edging and bonding with UK‑wide delivery or collection.

Need panels cut to your exact sizes? Use the form below to request a quote for cut to size panels, including optional edging and panel bonding.

To price your order accurately, please include your sizes, quantities, material type (MDF, plywood, decorative boards, compact laminate) and any finish/brand preferences (e.g. Egger, Kronospan, Saviola, Alvic). If you already have a décor code, add it in the notes and upload any drawings or photos that help explain the job.

If you don’t have a spreadsheet, download our cut list template, fill it in, and upload it with your request. We’ll confirm lead time and the best option for delivery anywhere in the UK or collection once we’ve reviewed your details.

Contact Details

Material & Services

Do you need edging? *
Do you need panel bonding (build up thickness)? *

Delivery / Collection

Delivery or Collection *

Your Cut List

Option 1: Upload your cut list file

If you have a spreadsheet (CSV, XLSX, or PDF) with your sizes, upload it here. Include:

  • Quantity of each part
  • Length, width and thickness (in mm)
  • Material type
  • Any notes about edging or special requirements

You can also upload drawings, sketches, or photos of your project if that's easier — we'll convert them into a cutting list.

Click or drag a file to this area to upload.

    Option 2: Use our template

    Fill in your sizes using our template, then upload the file. It's the fastest way to get an accurate quote.

    Example row explanation:

    • Quantity: 2 = we need 2 of these parts
    • Length × Width (mm): exact sizes you need
    • Thickness (mm): board depth (e.g. 18mm MFC, 16mm plywood)
    • Material: what you're ordering (MDF / Plywood / MFC / Decorative board / Compact laminate)
    • Edging (edges): which sides get edge banding (e.g. "front + left", "all 4 edges", "none")
    • Notes: anything that helps us — grain direction, matching pairs, bonding requirements, etc.